TPC Benchmark Full Disclosure Report.pdf

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TPC Benchmark ® C Full Disclosure Report © Tencent Cloud Computing (Beijing) Co., Ltd. 2023 1

TPC Benchmark

Full Disclosure Report

Tencent Database Dedicated Cluster (with

1650 TDSQL Data Nodes)

Using

Tencent TDSQL v10.3 Enterprise Pro Edition

with Partitioning and Physical Replication

First Edition

March 28, 2023

TPC Benchmark ® C Full Disclosure Report © Tencent Cloud Computing (Beijing) Co., Ltd. 2023 2

First Edition – March 28, 2023

Tencent Cloud Computing (Beijing) Co., Ltd., as the Sponsor of this benchmark test, believes that the pricing information in

this document is accurate as of the publication date, and is subject to change without notice. The Sponsor assumes no

responsibility for any errors that may appear in this document. The pricing information is believed to accurately reflect the

current prices as of the publication date. However, the Sponsor provides no warranty of the pricing information in this document.

The performance information in this document is for guidance only. Benchmark results are highly dependent on many factors

including workload, hardware, operating environments, specific application requirements, and system design and

implementation. Relative system performance may vary significantly as a result of these and other factors. The Sponsor does

not warrant or represent that a user can or will achieve the same or similar performance expressed in transaction per minute

(tpmC

) or normalized price/performance ($/tpmC

). No warranty on system performance is either expressed or implied.

TDSQL is a registered trademark of Tencent and/or its affiliates.

Intel and Intel Xeon are trademarks or registered trademarks of Intel Corporation.

TPC Benchmark, TPC-C, and tpmC are trademarks of the Transaction Processing Performance Council.

All other products mentioned herein are trademarks or registered trademarks of their respective owners.

its use, copying, distribution, and de-compilation. No part of this product or related documentation may be reproduced in any

form by any means without the prior written authorization of Tencent Cloud Computing (Beijing) Co., Ltd. and its licensors,

if any.

THIS PUBLICATION IS PROVIDED WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A

PARTICULAR PURPOSE, OR NON-INFRINGEMENT.

THIS PUBLICATION COULD INCLUDE TECHNICAL INACCURACIES OR TYPOGRAPHICAL ERRORS. TENCENT

CLOUD COMPUTING (BEIJING) CO., LTD. MAY MAKE IMPROVEMENTS AND/OR CHANGES IN THE PRODUCT(S)

AND/OR THE PROGRAM(S) DESCRIBED IN THIS DOCUMENT.

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